PAC Tech—Packaging Technologies GmbH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 687
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
F26B DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM 129
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 145
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9685423 Semiconductor chip assembly and method for manufacturing the sameJan 22, 14Jun 20, 17[H01L, B23K]
9401298 Method and device for transferring a chip to a contact substrateApr 10, 06Jul 26, 16[H01L]
9327360 Method and device for contacting, positioning and impinging a solder ball formation with laser energyJan 24, 08May 03, 16[B23K, H05K]
8742571 Diode array and method for producing a diode arraySep 15, 10Jun 03, 14[H01L]
8497578 Terminal face contact structure and method of making sameMar 10, 09Jul 30, 13[H01L]
8480298 Device for positioning and contacting test contactsOct 05, 09Jul 09, 13[G01K]
8361881 Method for alternately contacting two wafersMar 29, 11Jan 29, 13[H01L]
8328068 Transfer device for receiving and transferring a solder ball arrangementApr 17, 08Dec 11, 12[B23K]
8256131 Method and device for drying circuit substratesDec 22, 04Sep 04, 12[F26B]
8205325 Device for applying an electronic componentMar 30, 09Jun 26, 12[B23P]

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Expired/Abandoned/Withdrawn Patents

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